SMT Assembly
A full turnkey electronic assembly manufacturer for prototype to high volume PCB Assembly.
Advanced Equipment & Technology
We operate multiple high-speed pick-and-place machines capable of handling fine-pitch components such as 0201, 0402, QFN, and BGA with placement accuracy within ±0.02mm. Our stencil printers work in tandem with SPI (Solder Paste Inspection) equipment using 3D imaging to ensure consistent solder paste volume and precise deposition. Reflow ovens with multi-zone temperature control support lead-free profiles, while 100% AOI (Automated Optical Inspection) and X-ray inspection detect defects such as solder bridges, tombstoning, and hidden joint issues early in the process
Our Equipment
SMT PCB Assembly Capabilities at STHL
We are equipped with advanced assembly and inspection equipment to support reliable PCB Assemblies. Our highly trained and experienced staff make sure your projects completed faster with high quality. Our capabilities in high-quality SMT PCB assembly services include, but not limited to:
- Ball Grid Array (BGA)
- Ultra-Fine Ball Grid Array (uBGA)
- Quad Flat Pack No-Lead (QFN)
- Quad Flat Package (QFP)
- Small Outline Integrated Circuit (SOIC)
- Plastic Leaded Chip Carrier (PLCC)
- Package-On-Package (PoP)
- Small Chip Packages (pitch of 0.2 mm)
- AOI inspection
- X-Ray Inspection
STHL SMT Equipment and Capability
| Line order | Equipment | Component package | PCB size range | Components packing type | CHIP(H) | ||
| MIN. | MAX. | MIN. | MAX. | ||||
| Panasonic Line 1 | DESEN Classic-1008 + SINIC-TEK + NPM-D3 + NPM-D3 + NPM-D3 + NPM-TT2 + JT NS-1000II + AOI (double track LI-3000DP) | 01005 | 100×90mm Pitch=0.2mm |
50×50mm | 510×590mm | 290 Tape (reel) 20 Tray |
272000 |
| Panasonic Line 2 | DESEN Classic-1008 + SINIC-TEK + NPM-D3 + NPM-D3 + CM212 + JT JTR-1203D-N(12 temperature zone nitrogen furnace) + 3D AOI (double track EDgeD) | 01005 | 100×90mm Pitch=0.2mm |
50×50mm | 340×250mm | 256 Tape(reel) 20 Tray |
206000 |
| Panasonic Line 3 | DESEN Classic-1008 + SINIC-TEKNPM-D3+ NPM-D3 + CM212M + RH-500B + JT JTR-1203D-N(12 temperature zone nitrogen furnace) + 3D AOI | 01005 | 100×90mm Pitch=0.2mm |
50×50mm | 340×250mm | 256 Tape(reel) 22 Tray |
206000 |
| Panasonic Line 4 | DESEN DPS-1008 + CM402L + CM212M + JT NS-1000 + AOI(JTA-320-2M) | 0201 | 100×90mm Pitch=0.2mm |
50×50mm | 510×460mm | 336 Tape(reel) 20 Tray |
100000 |
| Mirae Line 5 | DSP-1008 + MX400 + MX200 + MX200 + MX200P + JT NS1000 + AOI (JTA-315-2M) |
0603 | 45×150mm | 50×50mm | 400×340mm | 280 Tape(reel) 20 Tray |
79000 |
| Mirae Line 6 | DSP-1008+MX200+MX200+MX200P | 0603 | 45×150mm | 50×50mm | 400×340mm | 120 Tape(reel) 22 Tray |
30000 |
| Total chips per hour | 893000 | ||||||