Surface Mount PCB Assembly

In surface mount PCB assembly, components are mounted directly on the PCB surface by automatic SMT machines. This assembly technique is applied in many applications such as Communications, Security, Computer, Medical, Industrial, Automotive electronics and Smart home fields. With 6 automated PCB assembly production lines, we are capable of assembling low volume PCBA prototype and high volume PCBA orders. We ensure consistent high quality and accurate placement of components with the use of the latest SMT technology. Our surface mount SMT PCB assemblies are known for their high mechanical strength, making them a reliable choice for high-speed circuit and de-coupling applications.

Advanced Equipment & Technology

We operate multiple high-speed pick-and-place machines capable of handling fine-pitch components such as 0201, 0402, QFN, and BGA with placement accuracy within ±0.02mm. Our stencil printers work in tandem with SPI (Solder Paste Inspection) equipment using 3D imaging to ensure consistent solder paste volume and precise deposition. Reflow ovens with multi-zone temperature control support lead-free profiles, while 100% AOI (Automated Optical Inspection) and X-ray inspection detect defects such as solder bridges, tombstoning, and hidden joint issues early in the process

SMT PCB Assembly Capabilities at STHL

We are equipped with advanced assembly and inspection equipment to support reliable PCB Assemblies. Our highly trained and experienced staff make sure your projects completed faster with high quality. Our capabilities in high-quality SMT PCB assembly services include, but not limited to:

  • – Ball Grid Array (BGA)
  • Ultra-Fine Ball Grid Array (uBGA)
  • Quad Flat Pack No-Lead (QFN)
  • Quad Flat Package (QFP)
  • Small Outline Integrated Circuit (SOIC)
  • Plastic Leaded Chip Carrier (PLCC)
  • Package-On-Package (PoP)
  • Small Chip Packages (pitch of 0.2 mm)
  • AOI inspection
  • X-Ray Inspection
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SMT Assembly

A full turnkey electronic assembly manufacturer for prototype to high volume PCB Assembly.

Line order Equipment Component package PCB size range Components packing type CHIP(H)
MIN. MAX. MIN. MAX.
Panasonic Line 1 DESEN Classic-1008 + SINIC-TEK + NPM-D3 + NPM-D3 + NPM-D3 + NPM-TT2 + JT NS-1000II + AOI (double track LI-3000DP) 01005 100×90mm
Pitch=0.2mm
50×50mm 510×590mm 290 Tape (reel)
20 Tray
272000
Panasonic Line 2 DESEN Classic-1008 + SINIC-TEK + NPM-D3 + NPM-D3 + CM212 + JT JTR-1203D-N(12 temperature zone nitrogen furnace) + 3D AOI (double track EDgeD) 01005 100×90mm
Pitch=0.2mm
50×50mm 340×250mm 256 Tape(reel)
20 Tray
206000
Panasonic Line 3 DESEN Classic-1008 + SINIC-TEKNPM-D3+ NPM-D3 + CM212M + RH-500B + JT JTR-1203D-N(12 temperature zone nitrogen furnace) + 3D AOI 01005 100×90mm
Pitch=0.2mm
50×50mm 340×250mm 256 Tape(reel)
22 Tray
206000
Panasonic Line 4 DESEN DPS-1008 + CM402L + CM212M + JT NS-1000 + AOI(JTA-320-2M) 0201 100×90mm
Pitch=0.2mm
50×50mm 510×460mm 336 Tape(reel)
20 Tray
100000
Mirae Line 5 DSP-1008 + MX400 + MX200 + MX200 +
MX200P + JT
NS1000 + AOI (JTA-315-2M)
0603 45×150mm 50×50mm 400×340mm 280 Tape(reel)
20 Tray
79000
Mirae Line 6 DSP-1008+MX200+MX200+MX200P 0603 45×150mm 50×50mm 400×340mm 120 Tape(reel)
22 Tray
30000
Total chips per hour 893000